Advanced Semiconductor Packaging Market: Size, Share, Trends & Forecast (2024-2029)
The market report offers a detailed analysis segmented by Packaging Type (Fan-out Wafer-Level Packaging, Fan-in Wafer-Level Packaging, Flip Chip, 2.5/3D); by Application (Processor/Baseband, Central Processing Unit/Graphical Processing Units, Dynamic Random Access Memory, NAND, Image Sensors, Others); by End User (Telecommunications, Automotive, Aerospace & Defense, Medical Devices, Consumer Electronics); by Geography (North America, South America, Asia Pacific, Europe, the Middle East, Africa).
Outlook
- The advanced semiconductor packaging market is estimated to be at USD 31,738.33 Mn in 2024 and is anticipated to reach USD 40,846.66 Mn in 2029.
- The advanced semiconductor packaging market is registering a CAGR of 5.18% during the forecast period of 2024-2029.
- The global advanced semiconductor packaging market growth is driven by increasing demand for high-performance computing, Artificial Intelligence (AI), and Internet of Things (IoT) devices that require more sophisticated packaging solutions.
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Ecosystem
- innovations in advanced packaging technologies such as 3D packaging, fan-out, and chiplet architectures.
- These companies primarily focus on R&D to stay ahead in the market, along with strategic partnerships and collaborations to keep a competitive edge in the market.
- Several important entities in the advanced semiconductor packaging market include Intel Corp.; Amkor Technology; Infineon Group; ASE Technology Holding Co., Ltd.; Kyocera Corp.; and others.
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Findings
| Attributes | Values |
|---|---|
| Historical Period | 2018-2022 |
| Base Year | 2023 |
| Forecast Period | 2024-2029 |
| Market Size (2024) | USD 31,738.33 Mn |
| Market Size (2029) | USD 40,846.66 Mn |
| Growth Rate | 5.18% CAGR from 2024 to 2029 |
| Key Segments | Packaging Type (Fan-out Wafer-Level Packaging, Fan-in Wafer-Level Packaging, Flip Chip, 2.5/3D); Application (Processor/Baseband, Central Processing Unit/Graphical Processing Unit, Dynamic Random Access Memory, NAND, Image Sensors, Others); End User (Telecommunications, Automotive, Aerospace & Defense, Medical Devices, Consumer Electronics); Geography (North America, South America, Asia Pacific, Europe, The Middle East, Africa) |
| Key Vendors | Intel Corp.; Amkor Technology; Infineon Group; ASE Technology Holding Co., Ltd.; Kyocera Corp. |
| Key Countries | The US; Canada; Mexico; Brazil; Argentina; Colombia; Chile; China; India; Japan; South Korea; The UK; Germany; Italy; France; Spain; Turkey; UAE; Saudi Arabia; Egypt; South Africa |
| Largest Market | Asia Pacific |
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Trends
- Chiplet-Based Architectures: The focus on chiplet-based architectures is expanding in advanced semiconductor packaging. Companies like AMD and Intel are moving away from traditional monolithic designs to modular chiplets, allowing for better customization and performance scaling.
- Advanced Semiconductor Packaging Technologies: Multi-chip package (MCP) and system-in-package (SiP) technologies have revolutionized semiconductor packaging, offering improved interconnects, advanced integration techniques, and enhanced thermal management. These innovations enable higher functionality, better performance, and smaller form factors, facilitating the development of compact, customized electronic devices with heterogeneous integration and driving overall innovation in the semiconductor industry.
- Advanced Materials: Manufacturers are exploring advanced materials to enhance the durability of semiconductor packages. In 2023, Samsung Electronics began using novel encapsulation materials that are more resistant to thermal and mechanical stress, improving the overall durability of devices.
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Catalysts
- Expansion of 5G Infrastructure: The rollout of 5G infrastructure globally is fueling demand for advanced semiconductor packaging. In 2023, Qualcomm announced a major push in 5G chipset development, requiring advanced packaging technologies to support high-speed data transfer and low latency in smaller form factors.
- Adoption of IoT Devices: With the proliferation of IoT devices across industries, there is a growing need for compact, efficient semiconductor packages. Companies like STMicroelectronics and Texas Instruments are investing in advanced packaging to power a new generation of connected devices.
- Push for Power Efficiency Devices: As power efficiency becomes more critical in electronics, particularly in mobile and wearable devices, advanced packaging is needed to reduce energy consumption while maintaining performance. In 2023, Apple and Samsung both emphasized energy-efficient packaging in their latest smartphone processors, driving demand for advanced semiconductor solutions.
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Restraints
- Supply Chain Constraints: The semiconductor industry has faced significant supply chain constraints, particularly with the shortage of key materials like substrates and advanced equipment. In 2023, TSMC and Intel faced disruptions due to a shortage of semiconductor substrates, delaying production schedules and limiting the supply of advanced packaging solutions.
- Integration Complexity: Integrating new advanced packaging technologies with existing semiconductor systems can be complex and time-consuming. In 2023, AMD encountered difficulties in incorporating new packaging solutions into its older-generation processors, which slowed the deployment of new product lines.
- Complexity of Manufacturing Processes: The increasing complexity of advanced packaging technologies, such as 3D stacking and fan-out, poses significant challenges in manufacturing. In 2023, several semiconductor companies, including GlobalFoundries, reported difficulties scaling up production due to the intricate processes involved, leading to delays and increased production costs.
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Table of Contents
| 1.       Introduction 1.1.    Research Methodology 1.2.    Scope of the Study 2.       Market Overview / Executive Summary 2.1.    Global Advanced Semiconductor Packaging Market (2018 – 2022) 2.2.    Global Advanced Semiconductor Packaging Market (2023 – 2029) 3.       Market Segmentation 3.1.    Global Advanced Semiconductor Packaging Market by Packaging Type 3.1.1. Fan-out Wafer-Level Packaging 3.1.2. Fan-in Wafer-Level Packaging 3.1.3. Flip Chip 3.1.4. 2.5/3D 3.2.    Global Advanced Semiconductor Packaging Market by Application 3.2.1. Processor/Baseband 3.2.2. Central Processing Unit/Graphical Processing Unit 3.2.3. Dynamic Random Access Memory 3.2.4. NAND 3.2.5. Image Sensors 3.2.6. Others 3.3.    Global Advanced Semiconductor Packaging Market by End User 3.3.1. Telecommunications 3.3.2. Automotive 3.3.3. Aerospace & Defense 3.3.4. Medical Devices 3.3.5. Consumer Electronics 4.       Regional Segmentation 4.1.    North America 4.1.1. The US 4.1.2. Canada 4.1.3. Mexico 4.2.    South America 4.2.1. Brazil 4.2.2. Argentina 4.2.3. Colombia 4.2.4. Chile 4.2.5. Rest of South America 4.3.    Asia Pacific 4.3.1. China 4.3.2. India 4.3.3. Japan 4.3.4. South Korea 4.3.5. Rest of Asia Pacific 4.4.    Europe 4.4.1. The UK 4.4.2. Germany 4.4.3. Italy 4.4.4. France 4.4.5. Spain 4.4.6. Rest of Europe 4.5.    The Middle East 4.5.1. Turkey 4.5.2. UAE 4.5.3. Saudi Arabia 4.5.4. Rest of the Middle East 4.6.    Africa 4.6.1. Egypt 4.6.2. South Africa 4.6.3. Rest of Africa 5.       Value Chain Analysis of the Global Advanced Semiconductor Packaging Market 6.       Porter Five Forces Analysis 6.1.    Threats of New Entrants 6.2.    Threats of Substitutes 6.3.    Bargaining Power of Buyers 6.4.    Bargaining Power of Suppliers 6.5.    Competition in the Industry 7.       Trends, Drivers and Challenges Analysis 7.1.    Market Trends 7.1.1.    Market Trend 1 7.1.2.    Market Trend 2 7.1.3.    Market Trend 3 7.2.    Market Drivers 7.2.1.    Market Driver 1 7.2.2.    Market Driver 2 7.2.3.    Market Driver 3 7.3.    Market Challenges 7.3.1.    Market Challenge 1 7.3.2.    Market Challenge 2 7.3.3.    Market Challenge 3 8.       Opportunities Analysis 8.1.    Market Opportunity 1 8.2.    Market Opportunity 2 8.3.    Market Opportunity 3 9.       Competitive Landscape 9.1.    Intel Corp. 9.2.    Amkor Technology 9.3.    Infineon Group 9.4.    ASE Technology Holding Co., Ltd. 9.5.    Kyocera Corp. 9.6.    Company 6 9.7.    Company 7 9.8.    Company 8 9.9.    Company 9 9.10.  Company 10 |
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Advanced Semiconductor Packaging Market – FAQs
1. What is the current size of the advanced semiconductor packaging market?
Ans. In 2024, the advanced semiconductor packaging market size is USD 31,738.33 Mn.
2. Who are the major vendors in the advanced semiconductor packaging market?
Ans. The major vendors in the advanced semiconductor packaging market are Intel Corp.; Amkor Technology; Infineon Group; ASE Technology Holding Co., Ltd.; Kyocera Corp.
3. Which segments are covered under the advanced semiconductor packaging market segments analysis?
Ans. The advanced semiconductor packaging market report offers in-depth insights into Packaging Type, Application, End User, and Geography.